RF Frequency600~2700MHz, IL8.9dB, SMD, Replace HJK-272H+
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| Parameters | Min | Typical | Max | Units |
|---|---|---|---|---|
| RF Frequency | 600 | ~ | 2700 | MHz |
| LO Frequency | 600 | ~ | 2700 | MHz |
| IF Frequency | 10 | ~ | 1000 | MHz |
| IL | 8.9 | dB | ||
| LO-RF ISO | 28 | dB | ||
| LO-IF ISO | 17 | dB |
| LO power | +17dBm设计保证 |
| 1 dB COMP. | +17dBm@Typ. |
| IP3 | 26dBm@Typ. |
| IP2 | 44dBm@Typ. |
| Impedance | 50Ω |
| Connector | SMD |
| Operation Temp. | -45~+85℃ Design assurance |
| Storage Temp. | -55~+100℃ Design assurance |
| Other | Replace HJK-272H+ |
| Pin number | 1 | 2 | 3 | other |
|---|---|---|---|---|
| Pin Definition | RF | LO | IF | GND |
| Frequency MHz | IF=10MHz ILdB | IF=210MHz ILdB | LO-RF(IF=10MHz) ISOdB | LO-IF(RF=2.81GHz) ISOdB | IF=10MHz P-1IN dBm | IF=1010MHz P-1IN dBm |
|---|---|---|---|---|---|---|
| 600 | -5.93 | -5.5 | -37 | -35.9 | 20 | 19.3 |
| 800 | -5.53 | -5.8 | -44.9 | -36.6 | 21.7 | 21 |
| 1000 | -5.63 | -5.7 | -56.2 | -36.8 | 21.4 | 19.2 |
| 1200 | -5.73 | -5.9 | -49 | -34.6 | 20.2 | 18.5 |
| 1400 | -6.03 | -5.9 | -40.1 | -34.6 | 18.6 | 18.6 |
| 1600 | -6.13 | -5.8 | -38.9 | -34.5 | 18 | 17.5 |
| 1800 | -6.23 | -5.8 | -41 | -35.5 | 18.5 | 16.9 |
| 2000 | -6.23 | -6.4 | -39.6 | -38.3 | 18.5 | 17.7 |
| 2200 | -6.43 | -6.7 | -39.8 | -38.3 | 17.9 | 16.7 |
| 2400 | -6.73 | -6.8 | -39.8 | -40.1 | 17.4 | 16.4 |
| 2600 | -6.83 | -6.7 | -39.6 | -36.2 | 17.5 | 17.1 |
| 2800 | -7.43 | -7.3 | -39.7 | -32.1 | 17.1 | 18.1 |
| 1 | Clean the surface of the product, do not soak the product in cleaning solution for cleaning. |
| 2 | The product supports 220 ℃ reflow soldering. |
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