21.2~23.6GHz, 1W, 2way, Phase0°
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| Parameters | Min | Typical | Max | Units |
|---|---|---|---|---|
| Frequency | 21.2 | ~ | 23.6 | GHz |
| Center loss | 0.6 | dB | ||
| Isolation | 20 | dB | ||
| Input VSWR | 1.5 | |||
| Output VSWR | 1.5 | |||
| Amplitude balance | 0.3 | dB | ||
| Phase balance | ±6 | ° |
| Power Capacity | 1W Design assurance |
| X-Way | 2-way |
| Phase | 0° |
| Impedance | 50Ω |
| Connector | Microstrip pad |
| Operation Temp. | -40~+85℃ Design assurance |
| Other | Thin film ceramics |
| Common port | 0 |
| Dispatch Port | 1，2 |
| 1 | The chip is recommended to be used in separate cavities, with a distance of 0.1mm from the sidewall on one side and a distance of 1-2mm from the upper cover on the surface. |
| 2 | Low stress conductive adhesive (ME8456) is recommended for bonding chips. |
| 3 | The chip should be installed on a carrier such as molybdenum copper, which is close to the thermal expansion coefficient of ceramics (6.7ppm/C °), with a carrier thickness of ≥ 0.2mm. |
| 4 | When the Microstrip of the circuit board is bonded to the chip, it is recommended to use a T-shaped structure at the microstrip bonding point for matching. |
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