Passband442.5MHz, DC-180MHz≥60dBc, 635-760MHz≥50dBc, SMD
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| Parameters | Frequency | / | Min | Typical | Max | Units |
|---|---|---|---|---|---|---|
| Passband | / | / | 442.5 | MHz | ||
| Passband IL | / | / | 1 | dB | ||
| Ripple in band | f0±42.5 | MHz | 0.3 | dB | ||
| Rejection | DC-180 | MHz≥ | 60 | dBc | ||
| Rejection | 635-760 | MHz≥ | 50 | dBc | ||
| Rejection | 960-1250 | MHz≥ | 70 | dBc | ||
| Rejection | 1500 | MHz≥ | 55 | dBc | ||
| Passband VSWR | f0±42.5 | MHz | 1.5 |
| Connector | SMD |
| Impedance | 50Ω |
| Power Capacity | 20W连续波 |
| 1dB BW | ≥85MHz |
| Delay ripple | ≤1.5nsf0±42.5MHz |
| Phase fluctuation | ±10° |
| Operation Temp. | -55~+85℃ Design assurance |
| 批产一至性 | 幅度：≤±0.2db@f0±42.5MHz 相位：≤±5°@f0±42.5MHz |
| 器件装焊工艺要求 | 适合于180℃回流焊接工艺，在微带板上峰值温度时间30至45秒， 可满足五次回流焊接，同时能通过-55℃~+85℃循环12次温度冲击筛选 |
| Other | 重量＜4g |
| 1 | Clean the surface of the product, do not soak the product in cleaning solution for cleaning. |
| 2 | The product supports 220 ℃ reflow soldering. |
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