Capacitance value4.7PF, Withstand voltage100V, Ceramic materials
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Adopting MM structure, the product has small parasitic parameters and a frequency of up to 100GHz.
Surface pure gold electrode, suitable for micro assembly processes such as gold wire and gold ribbon.
Suitable for Au/Sn, Au/Si, Au/Ge eutectic soldering, as well as Sn/Pb and conductive adhesive bonding.
| Parameters | Min | Typical | Max | Units |
|---|---|---|---|---|
| Capacitance value | 4.7 | PF | ||
| Capacitance error | ±0.5 | PF | ||
| Withstand voltage | 100 | V | ||
| Operation Temp. | -55 | ~ | +125 | ℃ |
| IL | 0.25 | dB@18GHz | ||
| IL | 0.5 | dB@40GHz |
| Quality Grade | Industrial grade |
| ROHS | Compliant Available |
| Other | Ceramic materials |


| Size Code | size | Units |
|---|---|---|
| L | 0.254±0.076 | mm |
| W | 0.254±0.076 | mm |
| T | 0.178±0.05 | mm |
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